HIGH DENSITY ELECTRONIC PACKING CONCEPTS

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$46,082.00
Award Year:
1989
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
9935
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Microcom Corp
965 Thomas De, Warminster, PA, 18974
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Charles Rosen
 (215) 672-6300
Business Contact
Phone: () -
Research Institution
N/A
Abstract
MICROCOM PROPOSES TO STUDY A VERY HIGH SPEED (100 TO 800 MBITS/SEC) DATA LINK WHICH WILL SAMPLE AND STORE PARALLEL DATA AND CONTROL INPUTS AND TRANSMIT THEM SERIALLY TO A REMOTE DESTINATION WHERE THE INFORMATION WILL BE REASSEMBLED IN ORIGINAL FORMAT. THUS A ONE MEDIUM LINK WILL REPLACE HIGH DENSITY MULTIPIN CONNECTORS. STUDY WILL HIGHLIGHT ENVIRONMENTAL CONSIDERATIONS AND COST EFFECTIVENESS.

* information listed above is at the time of submission.

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