Hardened by Design Cryogenic Infrared Focal Plane Array Readout Integrated Circuit

Award Information
Agency:
Department of Defense
Amount:
$100,000.00
Program:
SBIR
Contract:
W9113M-07-C-0081
Solitcitation Year:
2006
Solicitation Number:
2006.3
Branch:
Missile Defense Agency
Award Year:
2007
Phase:
Phase I
Agency Tracking Number:
B063-045-0573
Solicitation Topic Code:
MDA06-045
Small Business Information
MICROELECTRONICS RESEARCH DEVELOPMENT CO
4775 Centennial Avenue, Suite 130, Colorado Springs, CO, 80919
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
619085371
Principal Investigator
 Joseph Benedetto
 Principal Investigator
 (719) 531-0805
 joseph.benedetto@micro-rdc.com
Business Contact
 Mary Dyson
Title: Director Business Operations
Phone: (505) 294-1962
Email: mary.dyson@micro-rdc.com
Research Institution
N/A
Abstract
We have developed transistor level radiation tolerant design techniques for the manufacture of radiation resistant digital and mixed signal devices, including infrared (IR) focal plane array (FPA) readout integrated circuits (ROICs), and verified the operation and radiation performance to 43K (-230°C). We have achieved designs that exhibit significant hardness (i.e., very little change in the transistor characteristics) when irradiated to 1Mrad(Si) at 43K. These basic transistor elements were fabricated in a 180nm technology node and can be used for the design, manufacture and production of IRFPAs for spaceborne applications. Further, our design enhancements can easily be scaled to more advanced nodes (130nm and below for high-density ROICs). For maintaining higher-voltage compatibility, the radiation tolerant design techniques can be “reverse scaled” to larger line-width technologies and higher voltage levels (limited only by the available fabrication processes). Our design team has extensive experience in using hardness-by-design techniques (20+ years) to achieve TID, singe event effects (SEE) and prompt dose hardness levels from strategic (military environments) to radiation tolerance for lower cost spaceborne applications. By optimizing and expanding our design techniques, we can maintain our demonstrated radiation hardness, even when analog mixed signal devices are irradiated in a cryogenic environment.

* information listed above is at the time of submission.

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