Dual Chip Approach to Radiation Hardened Logic

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$1,490,520.00
Award Year:
2007
Program:
SBIR
Phase:
Phase II
Contract:
FA9453-07-C-0039
Agency Tracking Number:
F061-256-4000
Solicitation Year:
2006
Solicitation Topic Code:
AF06-256
Solicitation Number:
2006.1
Small Business Information
MICROELECTRONICS RESEARCH DEVELOPMENT CO
4775 Centennial Avenue, Suite 130, Colorado Springs, CO, 80919
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
619085371
Principal Investigator
 Patrick McGuirk
 Principal Investigator
 (505) 294-1962
 patrick.mcguirk@micro-rdc.com
Business Contact
 Mary Dyson
Title: Director Business Operati
Phone: (505) 294-1962
Email: mary.dyson@micro-rdc.com
Research Institution
N/A
Abstract
In an electronics system, the incorporation of reprogrammable logic, such as Field Programmable Gate Arrays (FPGAs), into the design can offer many benefits to a digital designer. For radiation hardened reprogrammable electronics, the choices among appropriate devices are very limited. AFRL is at the forefront of designing and developing high performance radiation hardened digital solutions. One such solution is the Via Programmable Gate Array (VPGA), which offers designers the high performance offered by a deep-submicron (90 nm) process, and the flexibility of reprogrammability with only one mask layer change. However, for a design engineer accustomed to working with COTS FPGAs engineers, the path to implementing the design into the VPGA is not trivial. A design methodology is proposed to ease this migration. This design approach will facilitate the transferal of FPGA designs to VPGA designs. As an option to this proposal, we offer to design, manufacture, and test four flight designs crucial to the development of the Plug-n-Play Satellite (PnPSat). Because these designs are predominantly FPGA based, the option can serve as a springboard to VPGA implementations of these designs.

* information listed above is at the time of submission.

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