Reliable and Rad-Hard Microelectronics

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-09-M-0095
Agency Tracking Number: F083-197-0970
Amount: $99,917.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: AF083-197
Solicitation Number: 2008.3
Small Business Information
4775 Centennial Boulevard, Suite 130, Colorado Springs, CO, 80919
DUNS: 619085371
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Michael Sibley
 Senior Research Scientist
 (505) 294-1962
Business Contact
 Karen Van Cura
Title: President and Chief Opera
Phone: (719) 531-0805
Research Institution
Producing components that satisfy all of the BMDS space and interceptor environment specs traditionally has been not only costly but also untimely.  As semiconductor companies continue along path set by Moores Law producing chips that have the necessary lifetime of a MIL Space application is a matter of fact.  Testing must be preformed on the silicon to ensure that the silicon will meet or exceed the extreme environments of space.  We propose in the Phase I test circuits that will enhance the reliability and the radiation hardness of the process.  On-chip metrology circuits will be designed to reduce test time and simplify the test setup. BENEFIT: If a Phase II and Phase III options are exercised for this proposal the AFRL and other DoD systems will have access to state of the art on-chip metrology circuits for monitoring the reliability radiation hardness of the Structured ASIC wafers.  Micro-RDC will be able to pre-screen Structured ASIC die quickly before they are sent of for full P&Q.  Micro-RDC will also be able to collect an extensive history of the process on a lot to lot bias.  These metrology circuits will not be limited to the 90 nm Structured ASIC fabric but will be useful in qualification of many technologies nodes.

* Information listed above is at the time of submission. *

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