Design-Hardened Radiation Tolerant Microelectronics

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$1,249,994.00
Award Year:
2009
Program:
SBIR
Phase:
Phase II
Contract:
FA9453-09-C-0012
Award Id:
86700
Agency Tracking Number:
F073-094-1509
Solicitation Year:
2007
Solicitation Topic Code:
AF073-094
Solicitation Number:
2007.3
Small Business Information
4775 Centennial Boulevard, Suite 130, Colorado Springs, CO, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
619085371
Principal Investigator:
Michael Sibley
Engineer II
(505) 294-1962
michael.sibley@micro-rdc.com
Business Contact:
Karen Cura
Cheif Financial Officer
(719) 531-0805
karen.vancura@micro-rdc.com
Research Institute:
n/a
Abstract
Producing components that satisfy all of the BMDS space and interceptor environment specs traditionally has been not only costly but also untimely. One of the most difficult design constraints is making the components unaffected by the radiation environments of space. We propose to develop and demonstrate a radiation hardened ASIM3 in the IBM 9FLP process. This will be accomplished using the Structured ASIC fabric developed on another AFRL SIBR topic. BENEFIT: If a Phase II and Phase III options are exercised for this proposal the AFRL and other DoD systems will have access to radiation hardened ASIM. As older process become obsolete or their"Trusted Foundry"status changes the space community will be forced to migrate to different foundries and processes. This Phase II effort will show the Aerospace community that getting radiation hardened integrated circuits is now quick turn and inexpensive compared to traditional methods of design. This flow will be very analogous to FPGA development which will enable FPGA designers to produce hardened electronics with minimal radiation effects knowledge.

* information listed above is at the time of submission.

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