AUTOMATED ELECTRONIC CIRCUIT MANUFACTURING USING INK JET TECHNOLOGY

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$50,000.00
Award Year:
1988
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
7547
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Microfab Technologies Inc
1104 Summit Avenue, Suite 110, Plano, TX, 75074
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
DAVID B WALLACE
() -
Business Contact:
() -
Research Institution:
n/a
Abstract
THE FEASIBILITY OF PRODUCING ELECTRONIC CIRCUIT BOARDS, FLEXIBLE CIRCUITS, AND INTEGRATED CIRCUIT PACKAGES USING INKJET TECHNOLOGY WILL BE EVALUATED. IF SUCCESSFUL, THIS METHOD COULD BE INTERFACED WITH COMPUTER AIDED DESIGN SYSTEMS TO PRODUCE RAPID TURNAROUND OF PROTOTYPES. PACKAGING IS CURRENTLY ONE OF THE PACING ITEMS IN MOST CUSTOM CIRCUIT DEVELOPMENT. APPLICATION TO FOUR SPECIFIC CIRCUIT PROCESSES WILL BE EVALUATED. IC TAB BONDING CIRCUITS, CONVENTIONAL IC PACKAGING, FLEX CIRCUITS, AND PC BOARDS. THE FEASIBILITY OFPRODUCING THE ABOVE WILL BE EXAMINED USING A VARIETY OF MATERIALS (BOTH CONDUCTIVE AND MASKING) AND SUBSTRATES.

* information listed above is at the time of submission.

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