PICOLITER SOLDER DROPLET DISPENSING FOR ELECTRONICS MANUFACTURING

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: N/A
Agency Tracking Number: 14365
Amount: $242,610.00
Phase: Phase II
Program: SBIR
Awards Year: 1992
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
1104 Summit Ave Suite 110, Plano, TX, 75074
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David B. Wallace, Ph.d.
 Vp Technology Development
 () -
Business Contact
Phone: () -
Research Institution
N/A
Abstract
THE RESEARCH PROPOSED IN THIS DOCUMENT ADDRESSES SOLDER APPLICATION TO PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES WITH A NEW FLEXIBLE APPROACH THAT COULD BE EMPLOYED IN NUMEROUS APPLICATIONS, DIRECTED APPLICATION OF MOLTEN SOLDERDROPLETS, ON THE ORDER OF 30-100MUM, USING INK-JET PRINTING TECHNOLOGY. INK-JET PRINTING SYSTEMS USE THE EJECTION OF TINY DROPS OF INK TO PRODUCE AN IMAGE. THE DEVICES PRODUCE HIGHLY REPRODUCIBLE AND CONTROLLABLE DROPS, SO THAT A DROP MAY BE PRINTED AT A SPECIFIC LOCATION ACCORDING TO DIGITALLYSTORED IMAGE DATA. SEVERAL DISTINCT APPLICATIONS COULD EVOLVE FROM THIS RESEARCH. THESE INCLUDE: (1) A SURFACE MOUNT REWORK STATIONFOR REPLACEMENT OF BAD, OR IMPROPERLY ASSEMBLED COMPONENTS THAT INCORPORATES A HIGHLY ACCURATE AND AUTOMATED SOLDER DROPLET DISPENSING SYSTEM; (2) AN AUTOMATED IN-LINE SOLDER PPROCESS THAT WOULD DISPENSE ONE OR MORE TYPES OF SOLDER, AND FLUX, ONTO ELECTRONIC PRINTED CIRCUIT BOARD PADS FOR BONDING OF HIGH PIN COUNT, FINE PITCH SURFACE MOUNT COMPONENTS; AND (3) SYSTEMS FOR SPECIAL APPLICATIONS, SUCH AS DISPENSING SOLDER DROPLETS ONTO FLIP CHIP BONDS, BUMPS FOR TAPE AUTOMATED BONDING (TAB), AND SOLDER PADS FOR FLEX CIRCUIT INTERCONNECTS.

* Information listed above is at the time of submission. *

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