High Speed InP OEIC

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$65,000.00
Award Year:
2001
Program:
SBIR
Phase:
Phase I
Contract:
DTRA01-01-P-0185
Agency Tracking Number:
01-0090
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
MICROLINK DEVICES
P.O. Box 161, North Andover, MA, 01845
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Noren Pan
Chief Technology Officer
(847) 588-3001
noren_pan@mindspring.com
Business Contact:
Phil McCoy
Chief Financial Officer
(781) 224-3500
pmccoyesq@aol.com
Research Institution:
n/a
Abstract
The feasibility of a high speed InP based OEIC (optoelectronic integrated circuit) will be investigated.The combination of high speed InP based HBT will be integrated with a P-i-n photodetector. The integration of these two deviceswill simplify the material structure, the processing, and the packaging. A prototype of this OEIC will be built in Phase I.Phase II will focus on the improvement of the OEIC to handle data rates in excess of 40 Gb/s,reliability issues, manufacturability, and packaging issues of this circuit.InP based technology has a clear potential to significantly advance the data rate capability of optical communication circuits.The integration of high speed InP based HBT along with the laser and detector components can greatly simplify the circuit and improve the performanceand potentially lower the cost. Commercial application of this technology include high speed internet optical communication networks and high speedlocal area networkslocal area networks, and

* information listed above is at the time of submission.

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