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Neuromorphic chip for sensing, situational awarness, and decision making in radiative environments

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC22CA230
Agency Tracking Number: 22100
Amount: $4,567,449.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A2
Solicitation Number: SEQ_22_P2S_C1
Solicitation Year: 2022
Award Year: 2022
Award Start Date (Proposal Award Date): 2022-09-28
Award End Date (Contract End Date): 2024-05-09
Small Business Information
3448 Elings Hall, UC Santa Barbara
Santa Barbara, CA 93106-6105
United States
DUNS: 080596325
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Farnood Merrikh Bayat
 (805) 708-4652
Business Contact
 Farnood Merrikh Bayat
Phone: (805) 708-4652
Research Institution

By a direct extension of our Phase II contract with NASA, we propose to realize a prototype of a neuromorphic chip able to withstand heavy dosage of radiations, like those encountered in the Lunar environment. The neuromorphic chip will have multiple use in a space system, from sensor data analysis to control or to system diagnosis.In particular, during our concluded Phase II we realized a test chip in silicon that has been tested on the ground. That test chip demonstrated the architecture, the computing capabilities and clearly showed the potential to reach unprecedented speed and efficiency.The architecture revolves around a analog in-memory computing architecture, a non-von Neumann design that unifies the computing module and the memory module, which becomes one and the same, removing at its root the memory transfer bottleneck, hybridized with a co-designed digital accelerator. This hybrid architecture offers incredible advantages over purely digital architectures.A key part of the innovation will reside in the use of memristors or ReRAMs. We will team up with a tier 1 company in the semiconductor fabrication processes: Applied Materials.nbsp;The physics at the base of the memristor non-volatile memory behavior makes them particularly resilient to radiations.nbsp;In summary, in 20nbsp;months we will combine our experience in in-memory computing architectures built during the Phase II project with the Applied Materials processing experience to deliver a TRL 7 integrated system,nbsp;with a hybrid of digital and memristor-based in-memory computing chips, with the potential to unleash an unprecedented level of AI capabilities for Lunar explorations and beyond.

* Information listed above is at the time of submission. *

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