Passive Wireless Multi-Sensor Temperature and Pressure Sensing System Using Acoustic Wave Devices

Award Information
Agency:
National Aeronautics and Space Administration
Branch:
N/A
Amount:
$599,695.00
Award Year:
2005
Program:
STTR
Phase:
Phase II
Contract:
NNK05OB31C
Agency Tracking Number:
030066
Solicitation Year:
2003
Solicitation Topic Code:
T6.01
Solicitation Number:
N/A
Small Business Information
Microsensor Systems Inc.
62 Corporate Court, Bowling Green, KY, 42103-6673
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
14776
Principal Investigator
 Jacqueline Hines
 Principal Investigator
 (410) 991-4345
 jhines@ieee.org
Business Contact
 Dr. Hank Wohltjen
Title: Chief Technical Officer
Phone: (270) 745-0099
Email: hw@microsensorsystems.com
Research Institution
 University of Central Florida
 Andrea Adkins
 4000 Central Florida Blvd.
Orlando, FL, 32826
 (407) 823-0138
 Domestic nonprofit research organization
Abstract
This proposal describes the continued development of passive, orthogonal frequency coded (OFC) surface acoustic wave (SAW) sensors and multi-sensor systems, an enabling technology for remote wireless sensing of temperature, pressure, and a range of other measurands, for application to space explorations' demanding environments. Phase I demonstrated the technical feasibility of the OFC approach to produce passive solid-state SAW sensors that can be interrogated remotely using RF signals, and that respond with a signal that encodes both the sensor's identity and temperature measurements. OFC SAW temperature sensors similar to those demonstrated in Phase I are capable of operating over temperature ranges not possible with silicon, from cryogenic to 1,000oC. The spread-spectrum nature of the system proposed herein, which consists of multiple passive OFC SAW sensors interrogated remotely using chirped RF signals, provides increased processing gain and greater communication security. The proposed Phase II effort will develop and characterize prototype OFC SAW temperature sensors targeted to selected NASA and commercial applications, and demonstrate pressure sensors. The transceiver design will be optimized given the SAW operating parameters, conventional and innovative wafer-level packaging approaches (for devices capable of withstanding extreme environments) will be developed, and a complete breadboard wireless multi-sensor system will be demonstrated.

* information listed above is at the time of submission.

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