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High Heat Flux Laser Diode and/or Solid State Laser Cooling for Airborne and/or Spaceborne Directed Energy Applications

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F33615-03-C-2343
Agency Tracking Number: F021-2794
Amount: $746,325.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2003
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
9334 Overlook Trail, Eden Prairie, MN, 55347
DUNS: 105955400
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Geoffrey Campbell
 President
 (952) 914-9403
 geoff@microvection.com
Business Contact
 Elizabeth Estes
Title: Administrative Officer
Phone: (952) 914-9403
Email: liz@microvection.com
Research Institution
N/A
Abstract
Diode laser present one of the most challenging thermal problems in industry. The small footprint and very high power levels combine to create extremely high heat fluxes in the vicinity of the diode. Tese heat flux levels raise the diode temperature,leading to lower lasing efficiency, wavelength shifts, and reduced diode lifetime. The cooling problem becomes even more difficult when combined with requirements for low pressure drops, low coolant flow rates, reliability, long operating life, ease ofattachment, small volume, and low cost.The best performing thermal management solutions available in the marketplace today are provided through micro-impingement and microchannel cooling methods, which offer thermal resistances as low as 0.035 K-cm2/W. Many customers, however, have expressedinterest in achieving these thermal resistance levels at much lower coolant flow rates. To accomplish this, the Phase II effort will examine novel 2-phase microchannel designs, diamond cooling, and heat transfer enhancement approaches within themicrochannels.

* Information listed above is at the time of submission. *

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