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Hardened by Design (HBD) Readout Integrated Circuit (ROIC) Technology

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: DTRA01-02-P-0240
Agency Tracking Number: T021-0048
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
735 State Street
Santa Barbara, CA 93101
United States
DUNS: 062090113
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jeffrey Black
 Principal Investigator
 (505) 768-7709
 jblack@mrcmicroe.com
Business Contact
 Scot Fries
Title: Director of Contracts
Phone: (805) 963-8761
Email: fries@mrcsb.com
Research Institution
N/A
Abstract

"Electronics technology for space systems is at a critical juncture, especially for strategic systems. Maintenance and improvement of the two dedicated radiation hardened foundries will cost a lot of money and may still fall short of commercial foundryperformance. Hardened by design techniques have been applied to digital electronics produced on commercial foundries with good success in both performance and radiation hardness. Design techniques are also being applied to analog and mixed-signalelectronics with success. Cryogenic electronics are currently being overlooked. This project will revisit readout integrated circuit (ROIC) electronics technology for focal place arrays applied in space systems. Specifically, this project will examinealternative foundries for development of radiation hardened ROICs. MRC will perform an analysis of ROIC needs, develop a test device, and evaluate its radiation response under cryogenic conditions. This project will advance technology for spacesurveillance systems, enabling the application of improved focal plane arrays. As a result, this capability will improve nuclear weapons surety."

* Information listed above is at the time of submission. *

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