Laser-Based Nano and Micro Machining for Meso-Matter Tooling and Fabrication

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F33615-01-C-5700
Agency Tracking Number: 001ML-0919
Amount: $0.00
Phase: Phase I
Program: SBIR
Awards Year: 2001
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
P.O. Box 223, Miamisburg, OH, 45343
DUNS: 927253195
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Larry Dosser
 (937) 865-4481
Business Contact
 Larry Dosser
Title: President
Phone: (937) 865-4481
Research Institution
This proposal details a program that combines laser micromachining and micro-Raman spectroscopy for the development of advanced and innovative laser-based processing techniques. Such techniques will enable the production of micro- and nano-particle basedmesomatter for advance space based applications such as high power radars, cloaking technology, and large adaptive space optics. The proposed approach will not only lead to the development of innovative and superior forms of matter, but will createinnovative and integrated processing techniques that combine advanced tooling and in-situ monitoring as well. The proposed work will also generate a database of processing parameters that is vital for further advancement of the materials processing field.Micromachining will be used to directly create features in certain substrate materials that are sufficiently detailed to produce materials on the meso-scale. Tooling to mass-produce such meso-materials will also be fabricated by similar micromachiningprocesses. Both the tools and the meso-materials will be characterized by micro-Raman spectroscopy to monitor laser/matter interactions as a result of the micromachining process. The techniques and materials developed in this proposal will find numerouscommercial and military applications such as photon band gaps, direct-write electronics, and sensors. The work outlined in this proposal has been designed to permit the extension of the micromachining work into the sub-micron regime.

* information listed above is at the time of submission.

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