Laser Micromachining of Optical Structures and Surfaces

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-05-C-0207
Agency Tracking Number: B045-016-0205
Amount: $749,719.00
Phase: Phase II
Program: STTR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: MDA04-T016
Solicitation Number: N/A
Small Business Information
MOUND LASER & PHOTONICS CENTER, INC.
P.O. Box 223, Miamisburg, OH, 45343
DUNS: 927253195
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Kenneth Hix
 Research & Development Scientist
 (937) 865-3041
 kenhix@mlpc.com
Business Contact
 Larry Dosser
Title: President & CEO
Phone: (937) 865-4481
Email: dosserlr@mlpc.com
Research Institution
 WRIGHT STATE UNIV.
 Ellen Reinsch Friese
 3640 Colonel Gl
Dayton, OH, 45435
 (937) 775-2423
 Nonprofit college or university
Abstract
MLPC is aggressively developing the technological infrastructure for laser micromachining silicon carbide (SiC) mirror substrates to reduce both cost and long lead-times associated with current beryllium optics. During the Phase I STTR effort investigation into the effects of laser micromachining SiC substrates showed that no apparent defects such as microcracks are observed when machining over a wide range of laser processing parameters. This process flexibility allows for a broad range of tunabilty for optimizing material removal rate and surface finish. The key to the success of this effort was the effectiveness of the laser micromachining process coupled with the advantage of high-resolution optical mapping techniques for surface characterization. The focus of the Phase II effort is on developing a closed-loop contour machining process through implementation of high-resolution optical metrology and the development of analysis and control software. The software will analyze the surface contour data, compare it to the corresponding substrate CAD file, determine the volume of material requiring removal, and automatically generate the commands required to complete the machining process. Additionally, a complete metrological record for quality assurance of the substrate surface can be produced before the substrate is removed from the workstation. The proposed contour mapping and control feedback scheme for laser micromachining is not only applicable to SiC mirror substrate fabrication but can be used in a wide variety of other laser machining applications.

* information listed above is at the time of submission.

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