Laser Micromachining of Optical Structures and Surfaces

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,743.00
Award Year:
2004
Program:
STTR
Phase:
Phase I
Contract:
W9113M-04-P-0147
Agency Tracking Number:
B045-016-0205
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
MOUND LASER & PHOTONICS CENTER, INC.
P.O. Box 223, Miamisburg, OH, 45343
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
927253195
Principal Investigator:
Kenneth Hix
Research & Development Scientist
(937) 865-3041
kenhix@mlpc.com
Business Contact:
Larry Dosser
President & CEO
(937) 865-4481
dosserlr@mlpc.com
Research Institution:
University of Dayton
Claudette M Groeber
300 College Park
Dayton, OH, 45469
(937) 229-2919
Nonprofit college or university
Abstract
Advanced laser micromachining technology will prove to be a vital fabrication tool for high precision devices having functional features on the mesoscopic and microscopic scale. The proposed program will establish the fundamentals of advanced 3-D high precision laser micromachining of SiC and Si3N4 devices. The approach utilizes next generation high pulse repetition rate solid-state laser systems having pulse durations in the nanosecond, picosecond, and femtoseconds regimens. The laser-material interaction is an extremely dynamical process and changes imposed on the material may include morphological defects, oxidation, chemical decomposition, nano/micro cracking, and compressive or tensile stresses. The dependence of these effects on the laser processing parameters will be quantified using various high-resolution micro non-destructive evaluation (micro-NDE) techniques employing advanced sensor technology (AST). Micro-NDE will be utilized to define the optimal processing window for laser micromachining SiC and Si3N4. AST techniques such as laser-ultrasonics and thermal wave imaging will be used as a process monitoring and a quality assurance technique. Additionally, AST process monitoring will be evaluated as a possible process control technology.

* information listed above is at the time of submission.

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