Laser Micromachining of Optical Structures and Surfaces

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-04-P-0147
Agency Tracking Number: B045-016-0205
Amount: $99,743.00
Phase: Phase I
Program: STTR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: MDA04-T016
Solicitation Number: N/A
Small Business Information
MOUND LASER & PHOTONICS CENTER, INC.
P.O. Box 223, Miamisburg, OH, 45343
DUNS: 927253195
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Kenneth Hix
 Research & Development Scientist
 (937) 865-3041
 kenhix@mlpc.com
Business Contact
 Larry Dosser
Title: President & CEO
Phone: (937) 865-4481
Email: dosserlr@mlpc.com
Research Institution
 University of Dayton
 Claudette M Groeber
 300 College Park
Dayton, OH, 45469
 (937) 229-2919
 Nonprofit college or university
Abstract
Advanced laser micromachining technology will prove to be a vital fabrication tool for high precision devices having functional features on the mesoscopic and microscopic scale. The proposed program will establish the fundamentals of advanced 3-D high precision laser micromachining of SiC and Si3N4 devices. The approach utilizes next generation high pulse repetition rate solid-state laser systems having pulse durations in the nanosecond, picosecond, and femtoseconds regimens. The laser-material interaction is an extremely dynamical process and changes imposed on the material may include morphological defects, oxidation, chemical decomposition, nano/micro cracking, and compressive or tensile stresses. The dependence of these effects on the laser processing parameters will be quantified using various high-resolution micro non-destructive evaluation (micro-NDE) techniques employing advanced sensor technology (AST). Micro-NDE will be utilized to define the optimal processing window for laser micromachining SiC and Si3N4. AST techniques such as laser-ultrasonics and thermal wave imaging will be used as a process monitoring and a quality assurance technique. Additionally, AST process monitoring will be evaluated as a possible process control technology.

* information listed above is at the time of submission.

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