STTR Phase I: Laser Ablation - Diamond Turning Hybrid Process for Brittle Material Machining

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$149,547.00
Award Year:
2007
Program:
STTR
Phase:
Phase I
Contract:
0637697
Award Id:
84865
Agency Tracking Number:
0637697
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
720 Mound Ave, 6745 HOLLISTER AVENUE, Miamisburg, OH, 45342
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
927253195
Principal Investigator:
Ronald Jacobsen
Dr
(937) 865-4046
rljacobsen@mlpc.com
Business Contact:
Larry Dosser
PhD
(937) 865-4046
dosserlr@mlpc.com
Research Institution:
Western MI Univ
John A Patten
1903 West Michigan Ave.
Kalamazoo, MI, 49008 1887
(269) 276-3246
Nonprofit college or university
Abstract
This Small Business Technology Transfer (STTR) Phase I project, a collaboration between Mound Laser and Photonics Center and the Manufacturing Research Center at Western Michigan University, will develop a novel, synergistic method for precision machining of brittle materials and semiconductors by combining laser processing diamond turning. The method has the potential to greatly reduce wear of diamond machine tools, improve the surface quality of finished ceramics, and reduce overall process costs for machining and smoothing these notoriously difficult to process yet critically needed materials. Developing a successful technology will immediately impact the areas of silicon carbide mirrors for aerospace applications, and single crystal silicon carbide wafers for high temperature electronics. Other potential uses include fabrication of structural aerospace components, sensors, and ceramic bearings and seals. Exploitation of high performance ceramics in all of these areas is currently limited by the state of the art in cost effective, damage-free fabrication of engineered ceramics. The project will provide a valuable opportunity for students to participate in the advanced, state-of-the-art materials processing technology development.

* information listed above is at the time of submission.

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