Ultra-High-Heat-Flux Dissipation using Muti-Level Enhancement

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$776,978.00
Award Year:
2003
Program:
SBIR
Phase:
Phase II
Contract:
DASG6002C0050
Agency Tracking Number:
00-0345
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
MUDAWAR THERMAL SYSTEMS, INC.
1291 Cumberland Ave, Suite G, West Lafayette, IN, 47906
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
809830557
Principal Investigator:
Terry Tope
Principal Investigator
(765) 494-5705
mudawar@ecn.purdue.edu
Business Contact:
Issam Mudawar
President
(765) 494-5705
mudawar@ecn.purdue.edu
Research Institution:
n/a
Abstract
Despite numerous recent developments in the area of thermal management, there is now a critical shortage of cooling schemes that can handle anticipated heat loads in many military and commercial applications. The lack of effective cooling schemes hasemerged as an obstacle to electronic packaging at the device, module, and system levels. This study incorporates liquid cooling techniques and capitalizes upon the merits of phase-change (boiling) to dissipate a broad range of heat fluxes corresponding tomodest increases in device temperature. By carefully controlling the liquid coolant temperature, it is possible to influence bubble volume, extend cooling potential, and simplify the coolant conditioning loop. Significant improvements in coolingperformance will be achieved by incorporating powerful surface enhancement techniques which influence heat dissipation on both the macro and micro scales. The Phase II study will exceed 1000 watts per square centimeter from a module containing a multitudeof heat sources in order to serve defense needs for decades to come. The Phase II study will also result in practical cooling hardware tailored to specific defense applications.The proposed work is anticipated to provide thermal management solutions for future defense and commercial electronic and power systems. Examples include spacecraft, high-power-density lasers, military avionics, superomputers, nuclear fusion reactors, andx-ray medical devices.

* information listed above is at the time of submission.

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