Nanoimprint Lithography of Parallel Patterning of Nanoscale Magenetoelectronic Devices

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-02-M-0115
Agency Tracking Number: N02-055-05
Amount: $69,852.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
7 FOULET DRIVE, PRINCETON, NJ, 08540
DUNS: 108972048
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Linshu Kong
 Project Manager
 (609) 683-3973
 lkong@nanonex.com
Business Contact
 Lin Chou
Title: President
Phone: (609) 683-3973
Email: linchou@nanonex.com
Research Institution
N/A
Abstract
"The goal of the project is to develop nanoimprint lithography based fabrication processes for low-cost, parallel patterning of magnetic device structures of a size below 50 nm feature size. In particular, nanoimprint lithography (NIL) and reactive ionetching (RIE) of nanoscale rectangles and hollow cylinders in insulators will be studied. A variety of NIL masks will be fabricated using electron-beam lithography and RIE. NIL processes, resists and machines will be investigated to make them suitable tomeet the particular needs of fabrication of nanomagnetoelectronic devices. A variety of reactive ion etching (RIE) recipes will be explored to ensure the high-fidelity etching of these nanoscale structures.Several key technical personnel of Nanonex Corporation are former post-docs and graduate students of Prof. Chou of Princeton University's group, and are experts in nanofabrication, particularly NIL, RIE, and nanomagnetic structures. Professor Chou willserve as a consultant to the proposed project. The success of the proposed project will present a significant step forward in fabricating nanoscale magneto-electronic devices. Such devices are essential to many Navy and other military hardwires. Thefabrication technology can also benefit other nanostructures needed in military and civilian applications."

* Information listed above is at the time of submission. *

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