Production of High Purity Nanoparticles by Laser Assisted Molecular Beam Deposition (LAMBD)
Small Business Information
Nanopowder Enterprises, Inc.
120 Centennial Ave., Piscataway, NJ, 08854
AbstractNanostructured powders, with particle size in the 1 - 10 nm range, have shown great promise in the forming of advanced structural and functional materials for applications as tribological coatings, high surface area catalyst supports for cutting tools, thermal barrier coatings, capacitor and battery materials, dielectric and optoelectronic materials. Two problems are frequently encountered in the synthesis of nanoparticles: (1) carbide and nitride nanoparticles of reactive elements are invariably contaminated with oxygen, and (2) multicomponent materials are usually non-stoichiometric. Our collaborators at SUNY Buffalo have developed a patented Laser Assisted Molecular Beam Deposition (LAMBD) process, which is capable of solving both problems. Our goal in this program is to develop a LAMBD nanopowder production module, integrate it into our existing Nanopowder Production System, and thus expand our powder production capabilities. The LAMBD process, which is an unique combination of plasma/laser ablation techniques, gas flow modulations, and molecular beam expansions, has so far been used only for the deposition of high quality films on substrates. In Phase I, we will determine the process parameters affecting nanopowder production, synthesize test quantities of powders, and characterize them. In Phase II, we will incorporate the LAMBD module into our Chemical Vapor Condensation (CVC) production system to demonstrate production of nanopowders of nitrides, carbides, and multicomponent materials in sufficient quantities for our collaborators to use for evaluation purposes. In both Phase I and II, we will focus primarily on synthesis and processing of Aluminum Nitride (AlN), but we will extend the production capabilities, along with marketing and commercialization of powders, in Phase III.
* information listed above is at the time of submission.