Advanced High Temperature Adhesives for Thermally Stable Aero-assist Technologies

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX09CB55C
Agency Tracking Number: 074947
Amount: $599,981.00
Phase: Phase II
Program: SBIR
Awards Year: 2009
Solicitation Year: 2007
Solicitation Topic Code: S3.04
Solicitation Number: N/A
Small Business Information
201 Circle Drive N., Suite 102/103, Piscataway, NJ, 08854-3723
DUNS: 042939277
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Runqing Ou
 Principal Investigator
 (732) 868-3141
Business Contact
 Ganesh Skandan
Title: CEO
Phone: (732) 868-3141
Research Institution
Aero-assist technologies are used to control the velocity of exploration vehicles (EV) when entering earth or other planetary atmospheres. Since entry of EVs in planetary atmospheres results in significant heating, thermally stable aero-assist technologies are required to avoid the high heating rates while maintaining low mass. Polymer adhesives are used in aero-assist structures because of the need for high flexibility and good bonding between the different layers of polymer films or fabrics. However, current polymer adhesives cannot withstand temperatures above 400 C. Therefore, polymer adhesives capable of withstanding high temperatures (> 400 C) are highly desirable for NASA applications. The present proposal, a collaborative effort between NEI Corporation and a NASA supplier of inflatable structures, aims to utilize our nanotechnology capabilities to address this need. The goal of this program is to develop high temperature adhesives that exhibit high thermal conductivity in addition to increased thermal decomposition temperature. Enhanced thermal conductivity will help to dissipate heat quickly and effectively to avoid temperature rise to harmful levels. This, together with increased thermal decomposition temperature, will enable the adhesives to sustain transient high temperature conditions. A key innovation of the program is to control the nanoparticle morphology so that enhanced thermal conductivity can be realized at relatively low nanoparticle loading levels. Building upon the Phase I proof of concept, the Phase II program will further develop the technology and implement it in NASA and commercial prototypes, thereby increasing the TRL to 4 or greater.

* Information listed above is at the time of submission. *

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