Next Generation Shortwave Filter Shadowband Radiometer

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$99,999.00
Award Year:
2001
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-01ER83223
Award Id:
51696
Agency Tracking Number:
65807S01-I
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
P.O. Box 618, Christiansburg, VA, 24068
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Jeffrey Mecham
Research Scientist
(540) 953-1785
jbmecham@nanosonic.com
Business Contact:
Richard Claus
President
(540) 953-1785
roclaus@nanosonic.com
Research Institution:
n/a
Abstract
65807 Prior research has identified novel electron transport percolation effects in nanostructured thin films and structural epoxy adhesives that incorporate noble metal nanoclusters. Due to the ultrasmall size of the clusters, the onset of percolation can be controlled. Furthermore, the nanostructured nature of the adhesive also allows unique opportunities for the implementation of cure mechanisms initiated by external field excitation. This project will develop nanostructured, externally cure-initiated, and, potentially, electrically- and thermally-conductive adhesives for use in the fabrication of detectors used in nuclear physics. Phase I will demonstrate the feasibility of such cure initiation by external means, and also investigate the fundamental nature of electrical and thermal conductivity properties that may be useful for specialized adhesive bonding and packaging applications. Commercial Applications and Other Benefits as described by awardee: Externally cure-initiated nanostructured adhesives, including those with combined electrical and thermal conductivities, would enable the rapid practical assembly of electronic and structural components for detectors and other systems. Additional applications include uses as an electrically-conductive and thermally-conductive adhesive for chip-to-substrate bonding and thermal management, the low-cost electrical connection of materials used in electronic enclosures, and the bonding of precisely positioned materials where UV initiation is not practical.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government