Next Generation Shortwave Filter Shadowband Radiometer

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-01ER83223
Agency Tracking Number: 65807S01-I
Amount: $99,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2001
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
P.O. Box 618, Christiansburg, VA, 24068
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jeffrey Mecham
 Research Scientist
 (540) 953-1785
 jbmecham@nanosonic.com
Business Contact
 Richard Claus
Title: President
Phone: (540) 953-1785
Email: roclaus@nanosonic.com
Research Institution
N/A
Abstract
65807 Prior research has identified novel electron transport percolation effects in nanostructured thin films and structural epoxy adhesives that incorporate noble metal nanoclusters. Due to the ultrasmall size of the clusters, the onset of percolation can be controlled. Furthermore, the nanostructured nature of the adhesive also allows unique opportunities for the implementation of cure mechanisms initiated by external field excitation. This project will develop nanostructured, externally cure-initiated, and, potentially, electrically- and thermally-conductive adhesives for use in the fabrication of detectors used in nuclear physics. Phase I will demonstrate the feasibility of such cure initiation by external means, and also investigate the fundamental nature of electrical and thermal conductivity properties that may be useful for specialized adhesive bonding and packaging applications. Commercial Applications and Other Benefits as described by awardee: Externally cure-initiated nanostructured adhesives, including those with combined electrical and thermal conductivities, would enable the rapid practical assembly of electronic and structural components for detectors and other systems. Additional applications include uses as an electrically-conductive and thermally-conductive adhesive for chip-to-substrate bonding and thermal management, the low-cost electrical connection of materials used in electronic enclosures, and the bonding of precisely positioned materials where UV initiation is not practical.

* Information listed above is at the time of submission. *

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