Thermally Conductive Nanocomposites for Missile Electronics Packaging

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N00164-04-C-6068
Agency Tracking Number: 031-0878
Amount: $736,563.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: MDA03-049
Solicitation Number: 2003.1
Small Business Information
P.O. Box 618, Christiansburg, VA, 24068
DUNS: 008963758
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jennifer Lalli
 Research Scientist - Grou
 (540) 953-1785
Business Contact
 Richard Claus
Title: President
Phone: (540) 953-1785
Research Institution
The objective of this Phase II MDA program is to transition thermally and electrically conductive nanocomposites into missile defense electronic modules for improved packaging and thermal control. During Phase II, NanoSonic's thermal management materials would be integrated into BAE Systems North America sub-systems for Lockheed Martin's ballistic missile defense systems; Theatre High Altitude Area Defense (THAAD) and Miniature Kill Vehicles (MKV). The nanocomposites would replace aluminum chassis and other components on BAE System's infrared seeker for THAAD for a significant savings in weight and improved thermal performance. The anticipated performance improvements and reductions in cost associated with the manufacturing of electronic systems using these materials will be evaluated by our Phase II defense primes, Lockheed Martin Missiles and Space Company and BAE Systems. Nanocomposites prepared during Phase I with NanoSonic's advanced metal complexing polymers exhibited thermal conductivity values five times greater than nanocomposites prepared with commercially available resins. These high performance nanocomposites offer a wide service temperature range from ~ -120 ° to greater than 300 °C and are expected to improve the reliability of systems that perform in both endo- and exoatmosphere, such as THAAD. The nanocomposites effectively bond materials with highly mismatched CTEs, offer superior chemical resistance, and ultra-lightweight. Since thermal and electrical conductivity through bondlines depends upon bond thickness, nanosized inclusions lead to high conductivity. Materials would be optimized during Phase II and transitioned into its current manufacturing systems during Phase III. Our Phase III microelectronics partner would assist with scale-up.

* Information listed above is at the time of submission. *

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