Polymer Flip Chips with Extreme Temperature Stability in Space

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNG04CA87C
Agency Tracking Number: 035234
Amount: $69,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: S4.03
Solicitation Number: N/A
Small Business Information
Nanosonic Inc
1485 South Main St, Blacksburg, VA, 24060-5556
DUNS: 008963758
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jennifer Lalli
 Principal Investigator
 (540) 953-1785
 jlalli@nanosonic.com
Business Contact
 Richard Claus
Title: President
Phone: (540) 953-1785
Email: roclaus@nanosonic.com
Research Institution
N/A
Abstract
The objective of the proposed SBIR Phase I program is to develop highly thermally and electrically conductive nanocomposites for space-based flip chips for performance over a wide service temperature range (-60 ?C to 400 ?C). Novel polyorganosiloxanes with controlled concentrations of pendent complexing moieties for metals, oxide-fillers, or nanotubes would be crosslinked to generate highly conductive elastomeric nanocomposite networks. NanoSonic has recently demonstrated electrical resistance of 0.1 Ohm through adhesively bonded polycarbonate substrates with a poly(organo-complexing)siloxane Ag composite. Low stress interfacial adhesives remain flexible under cryogenic conditions, effectively bond highly mismatched CTE substrates, offer superior corrosion resistance towards fuels, are impervious to UV and ozone degredation, and offer significantly greater adhesive strength over typical polysiloxanes. Polysiloxanes are an ideal candidate material for space systems yet have not been exploited to their full potential due to poor adhesion and the inability to evenly disperse polar conductive fillers (resulting in segregation and adverse insulating locales). The proposed poly(organo-complexing)siloxanes yield stable even dispersions with polar conductive fillers and would be developed during Phase II for microelectronics packaging on space platforms and with a major electronics company for microelectronics as an environmentally sound, low-cost replacements for current lead-based soldering systems.

* information listed above is at the time of submission.

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