Polymer Flip Chips with Extreme Temperature Stability in Space

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$69,999.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
NNG04CA87C
Award Id:
72025
Agency Tracking Number:
035234
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1485 South Main St, Blacksburg, VA, 24060
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
008963758
Principal Investigator:
JenniferLalli
Principal Investigator
(540) 953-1785
jlalli@nanosonic.com
Business Contact:
Dr. RichardClaus
President
(540) 953-1785
roclaus@nanosonic.com
Research Institute:
n/a
Abstract
The objective of the proposed SBIR Phase I program is to develop highly thermally and electrically conductive nanocomposites for space-based flip chips for performance over a wide service temperature range (-60 ?C to 400 ?C). Novel polyorganosiloxanes with controlled concentrations of pendent complexing moieties for metals, oxide-fillers, or nanotubes would be crosslinked to generate highly conductive elastomeric nanocomposite networks. NanoSonic has recently demonstrated electrical resistance of 0.1 Ohm through adhesively bonded polycarbonate substrates with a poly(organo-complexing)siloxane Ag composite. Low stress interfacial adhesives remain flexible under cryogenic conditions, effectively bond highly mismatched CTE substrates, offer superior corrosion resistance towards fuels, are impervious to UV and ozone degredation, and offer significantly greater adhesive strength over typical polysiloxanes. Polysiloxanes are an ideal candidate material for space systems yet have not been exploited to their full potential due to poor adhesion and the inability to evenly disperse polar conductive fillers (resulting in segregation and adverse insulating locales). The proposed poly(organo-complexing)siloxanes yield stable even dispersions with polar conductive fillers and would be developed during Phase II for microelectronics packaging on space platforms and with a major electronics company for microelectronics as an environmentally sound, low-cost replacements for current lead-based soldering systems.

* information listed above is at the time of submission.

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