Highly Elastomeric Metal RubberT Sealants with Superb Electromagnetic Integrity

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$748,952.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-08-C-5603
Award Id:
82043
Agency Tracking Number:
F071-122-0503
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
P.O. Box 618, Christiansburg, VA, 24068
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
008963758
Principal Investigator:
J. Lalli
VP of Business Developmen
(540) 953-1785
jlalli@nanosonic.com
Business Contact:
Lisa Lawson
Contracts Administrator
(540) 953-1785
llawson@nanosonic.com
Research Institution:
n/a
Abstract
During Phase I of this SBIR program, NanoSonic has developed a novel, ultra-lightweight (<0.98 g/cc), unfilled, corrosion resistant, "nanocomposite" sealant material that offers EMI shielding (up to 70 dB) with unprecedented flexibility and electromagnetic (EM) integrity. Unlike typical nanocomposites that require 20-80 vol % filler (Ag flake) or 1-5 volume % for carbon nanotubes; NanoSonic demonstrated a novel processing method to achieve electrical percolation with <0.01 vol % of non-corrosive Au nanoparticles. Extremely durable materials result that provide excellent adhesion and EM shielding stability over a wide dynamic thermomechanical environment (from -65 degrees C to 330 degrees C, and after swelling for 7 days in harsh solvents). The elastomeric sealants maintain electrical conductivity at repeated strains >1000%, exhibits a surface resistivity of < 1/ when fitted into the gap; and the Metal RubberT technology and sealants are compatible with the current DoD based neat (unfilled) sealant resins. During Phase II, the unique unfilled sealants will be transitioned to the outer mold line of aircraft for electromagnetic discharge applications. NanoSonic has teamed with major defense primes and the leading aerospace sealant manufacturer for integration on aircraft such as the F-22, X-47B and B-2.

* information listed above is at the time of submission.

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