CNT Nanocomposites for Space-Based Electronics

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$100,000.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-09-M-0138
Award Id:
93137
Agency Tracking Number:
F083-214-0990
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
P.O. Box 618, Christiansburg, VA, 24068
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
008963758
Principal Investigator:
Michael Bortner
Chief Scientist for Hall
(540) 953-1785
jszabo@busek.com
Business Contact:
Lisa Lawson
Contracts Administrator
(540) 953-1785
judy@busek.com
Research Institution:
n/a
Abstract
The objective of this Air Force SBIR program is to determine the feasibility to use carbon nanotubes for fabrication of composite materials for a broad range of space systems electronics applications. NanoSonic will build on its patented nanocomposite synthesis and self-assembly fabrication techniques to fabricate nanocomposites suitable for integration into space systems technologies. Multiple approaches will be pursued to identify combinations of high electrical and/or thermal conductivity, composite strength, and suitability for large scale/volume manufacturing. The proposed materials and manufacturing processes are inherently low cost and extremely effective for fabrication of extremely uniform, well-dispersed nanocomposites for use in numerous engineered aerospace structures. Additionally, the proposed materials and processes offer methods to fully realize the benefits of CNT integration, resulting in significant enhancements in composite performance, weight and cost reduction, and multifunctional integration, all of which are crucial for Air Force and DoD vehicle and structure sustainability. BENEFIT: Potential DoD applications are nearly limitless with the proposed manufacturing technology. The materials and process provide a method to fabricate high performance nanocomposites providing significant performance enhancements by realizing the full potential of nanomaterials. Electronics application may benefit from enhanced thermal conductivity packaging and heat sinks, as well as from high performance device fabrication. Structural applications will all benefit via materials and composites with significantly enhanced performance and potentially significant weight reductions over currently used materials. Thermally conductive composites may be manufactured with higher performance and reduced cost compared to current methods. Well-dispersed electrically conductive materials, such as CNTs, provide a facile method for low cost shielding or other conductive pathway integration directly into composite materials. Non-DoD applications are also nearly limitless. The proposed materials and process facilitate fabrication of higher performance, stronger, and lighter weight materials with a process that is directly insertable into current manufacturing operations, potentially reducing cost via higher throughput and significantly enhancing material performance. For specialty applications, integration of multifunctionality provides a method to fabricate higher performance materials. Thermally insulating nanocomposites could be fabricated for applications such as automotive firewalls or high performance insulations. Electrically conductive nanocomposites can provide EMI shielding for cellular telephones and other portable communications devices.

* information listed above is at the time of submission.

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