Metal Rubber™ Replacements for Conventional Metal Materials in USVs

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N65538-09-M-0067
Agency Tracking Number: N091-047-0518
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2009
Solicitation Topic Code: N091-047
Solicitation Number: 2009.1
Small Business Information
NanoSonic, Inc.
P.O. Box 618, Christiansburg, VA, 24068
DUNS: 008963758
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Richard Claus
 President
 (540) 953-1785
 roclaus@nanosonic.com
Business Contact
 Lisa Lawson
Title: President
Phone: (540) 953-1785
Email: llawson@nanosonic.com
Research Institution
N/A
Abstract
This SBIR program would demonstrate the feasibility of replacing heavy metal materials and components onboard unmanned surface vehicles (USVs) with equivalent materials and components fabricated using lightweight Metal Rubber™. Metal Rubber™ is a self-assembled nanocomposite material with an electrical conductivity on the order of that of bulk copper (107 S/m). Its mass density (1 g/cc) is much less than that of copper (8.96 g/cc), steel (8 g/cc) or aluminum (2.7 g/cc). Replacing copper or other bulk metal components onboard USVs with Metal Rubber™ thus may result in a weight savings of between 90% for copper to 60% for aluminum. During the Phase I program, NanoSonic would work with input from a major ship systems manufacturer, and design, fabricate and analyze the properties of representative structural, electrical, RF shielding and thermally conductive materials based on Metal Rubber™ materials. Materials large enough to be representative of full-size USV structures would be produced and tested. These hardware test articles will allow a direct calculation of the total weight savings possible by replacing conventional metals with Metal Rubber™. Technical specifications and weight savings would be used to downselect optimal development paths during a possible Phase II program in cooperation with that ship system manufacturer

* information listed above is at the time of submission.

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