Scale Up of Components of Nanothermites with Tunable Properties and Characterization Thereof

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-08-C-0430
Agency Tracking Number: A062-058-0891
Amount: $729,966.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solitcitation Year: 2006
Solitcitation Topic Code: A06-058
Solitcitation Number: 2006.2
Small Business Information
NEMS/MEMS WORKS,LLC.
2306 Longview Drive, Columbia, MO, 65203
Duns: 148835619
Hubzone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Keshab Gangopadhyay
 President
 (573) 356-9459
 gangopadhyayk@missouri.edu
Business Contact
 Keshab Gangopadhyay
Title: President
Phone: (573) 356-9459
Email: gangopadhyayk@missouri.edu
Research Institution
N/A
Abstract
The primary objective of the Phase II research and development is to scale-up the production of components of nanoengineered thermites (or, nanothermites) in pound quantities in a safe manner. In Phase I, we have achieved the proof-of-concepts for the synthesis of several nanoscale oxides, assembly and physical mixing with the nanofuel, various coating processes and tuning the properties with explosives and chemicals for different applications. Our next goal is to develop various synthesis methods for large scale production of CuO Nanorods and Al nanoparticles as well as develop technology of self-assembled and other processes of mixing these nanocomposites with controlled ESD sensitivity. We will use semi-automated chemical synthesis methods for preparing large quantities of CuO nanorods. We will also develop arc-jet synthesis method to prepare large quantities of aluminum nanoparticles and develop in-situ metal, metal oxide or polymer coating of Al nanomaterials to control ESD sensitivity and stabilize the surface. In addition, polymer coating methods for CuO nanorods, nanoparticles and Al nanoparticles will also be developed. The testing of the novel nanothermites will be carried out in microdevices fabricated in our laboratory by using on-chip and other characterization techniques.

* information listed above is at the time of submission.

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