Magnetic Microscope for the Inspection of Multichip Modules

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 26687
Amount: $99,733.00
Phase: Phase I
Program: SBIR
Awards Year: 1994
Solitcitation Year: N/A
Solitcitation Topic Code: N/A
Solitcitation Number: N/A
Small Business Information
Neocera, Inc.
335 Paint Branch Drive, College Park, MD, 20742
Duns: N/A
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Steven Green
 (301) 314-9937
Business Contact
Phone: () -
Research Institution
N/A
Abstract
This is a proposal to develop and market a verification and inspection tool for MCM substrates. By reducing the risk of mounting good die on to defective MCM substrates, a significant reduction in cost and improvement in the yield and reliability of populated MCMs can be realized. A tool which detects potential problems during substrate manufacture, reduces substrates verification time, enhances substrate rework capabilities, and hence reduces the risk of mounting known good die on defective susbstrates has generic applicability to virtually all module types and will have essentially zero impact on module resources and performance. Recent developments in high temperature superconducting device technologies have enable the construction and testing of microscopes which are capable of detecting the magnetic fields associated with currents flowing in this metallic films. By analyzing the magentic fields, an image of the conductor responsible for the production of the fields is obtained. The overall goal of this SBIR program is to market a high temperature superconducting magnetic microscope dedicated to the inspection and verification of MCM substrates in a manufacturing environment. Anticipated Benefits: The anticipated benefit of the proposed research is the establishment and commercialization of the magnetic microscope as an inspection tool for MCM substrates. Incorporation of the microscope shoudl improve the yield, reduce the cost, and enhance the reliability of multichip modules.

* information listed above is at the time of submission.

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