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Compact Instant Multi-Spectral Imager

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-09-C-0139
Agency Tracking Number: 08SB2-0741
Amount: $98,996.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: SB082-046
Solicitation Number: 2008.2
Timeline
Solicitation Year: 2008
Award Year: 2008
Award Start Date (Proposal Award Date): 2009-01-05
Award End Date (Contract End Date): 2009-08-30
Small Business Information
16115 SW 117th Ave. A-15
Miami, FL 33177
United States
DUNS: 110012903
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Jame Yang
 Team Leader, Optics
 (305) 235-6928
 jyang@new-span.com
Business Contact
 Grace Wang
Title: President
Phone: (305) 235-6928
Email: gwang@new-span.com
Research Institution
N/A
Abstract

Multispectral/hyperspectral imaging is a technique that acquires and analyzes both spectral and spatial information. It provides the potential for more accurate and detailed information extraction than possible with those conventional imaging techniques. Spectral imaging sensors have applications in various military and commercial fields including spectral discrimination target identification, camouflage detection, environmental monitoring, etc. Thus far, some prototype spectral imaging systems have been produced, each with its own strengths and weaknesses. Especially, the volume and weight of these systems are too large to be portable. There is a demand to develop the optical train for a multispectral imager based on micro-optical elements that is ultra-compact compared to similar current optical systems. New Span Opto-Technology Inc. proposes herein an innovative optical architecture that can realize a compact multispectral imager. It can present spectral images of all desired bands instantly. Task dependent spectral bands selection will achieve optimal target discrimination. There is a potential to realize a dynamically reconfigurable spectral imager based on the proposed scheme. Phase I will conduct technical analysis and design, and construct a preliminary bench top experimental setup to demonstrate critical components technologies and the feasibility of the proposed concept. Phase II will fabricate a working sensor prototype.

* Information listed above is at the time of submission. *

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