Ultra-High Reliability Laser Diode Packages

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7327
Agency Tracking Number: B041-020-0634
Amount: $1,248,760.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solicitation Year: 2004
Solicitation Topic Code: MDA04-020
Solicitation Number: 2004.1
Small Business Information
5408 NE 88th Street, Bldg E, Vancouver, WA, 98665
DUNS: 799811646
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Mark DeFranza
 Project Manager
 (360) 566-4472
 mark.defranza@nlight.net
Business Contact
 David Gustafson
Title: Manager, Advanced Tech. P
Phone: (360) 566-4471
Email: david.gustafson@nlight.net
Research Institution
N/A
Abstract
High pulse energy lasers are a critical part of missile defense systems. Typical lasers deployed in missile defense applications require between 100mJ and 1 Joule of pulse energy and use diode pumped solid-state master oscillators typically based on a Neodymium doped crystal. To meet the laser system performance requirements, typically many individual laser diodes are needed to provide the necessary pump energy. Unfortunately, current laser diode packaging technology does not offer either the performance or reliability that is required for next generation missile defense applications; due to packaging limitations related to the availability of materials and assembly techniques. To meet the reliability requirements for these mission critical laser applications, we propose to utilize the best learning from the current state of the art in laser bar packaging and telecommunications laser package design. We intend to design and demonstrate a “common carrier” laser sub-mount that is applicable to a wide range of CW and QCW laser bar applications. We intend to design these carriers in such a way as to be applicable to a variety of conductively cooled packages, and to be compatible with water or cryogenically cooled high power stack systems.

* Information listed above is at the time of submission. *

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