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High Density Shock Survivable Microelectronics

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 32367
Amount: $749,869.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
11409 Valley View Road
Eden Prairie, MN 55344
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert A. Sinclair
 (612) 829-9217
Business Contact
Phone: () -
Research Institution
N/A
Abstract

A packaging system and process for minimizing the volume of shock hardened components will be designed and developed. Different multi-chip module (MCM) approaches will be investigated including laminate (MCM-L), ceramic (MCM-C), deposited thin film (MCM-D), and hybrids of the two (MCM-C/D). In addition, micro ball grid arrays on folded elastomeric substrates, 3-D High Density Interconnect (HDI) technology, and Stacked Silicon (SS) technologies will be evaluated. Samples of the selected technology will be tested with NVE's High G Tester (HGT) to prove their survivability. Increasing density by combining functions for a typical data recorder application on a single die will also be investigated such as incorporating a 32K x 8 high speed non-volatile memory, an analog-to-digital converter, and microprocessor on the same die using NVE's integrated circuit design technology. This chip could then be incorporated with the technology selected into an ultra dense stacked 3-D multichip module. NVE's new Magnetoresistive Random Access Memory (MRAM) technology would be studied for use in the 32K x 8 nonvolatile memory by shock testing arrays to insure that the bit designs were immune to magnetostriction. The results of this study would lead to an ultra-dense, high shock, programmable data recorder during a Phase II effort.

* Information listed above is at the time of submission. *

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