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High Speed Digital Bus Isolator for Space

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F29601-02-C-0004
Agency Tracking Number: 011NM-1952
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
11409 Valley View Road
Eden Prairie, MN 55344
United States
DUNS: 114264351
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 John Myers
 Vice President of Isolato
 (952) 996-1610
Business Contact
 James Daughton
Title: Chief Technology Officer
Phone: (952) 996-1607
Research Institution

NVE will produce and package IC's that monolithically integrate high speed GMR signal isolators into prototype high-speed 74245 type transceivers and 74573 type logic latches. Commercial high-speed data bus interfaces between microcontroller basedsubsystems have not been galvanically isolated due to performance, size and cost constraints. These interfaces would benefit from the inclusion of monolithically integrated high performance galvanic isolation barriers. The proposed devices will eliminatenoise, cross talk, and ground bounce and allow highly parallel long distance bus architectures. Products will find wide application in aerospace, military and commercial applications which require both high speed transceiver circuitry and galvanic signalisolation. NVE has successfully integrated IsoLoopr galvanic monolithic isolation technology into dual and quad channel transceiver silicon and will use this foundation to design/build/optimize isolated 4 and 8 channel devices. This technologysimultaneously meets requirements for high speed, low power, noise immunity and design flexibility required for high performance data busses. NVE will produce radiation tolerant 4 or 8 channel die for production worthy 8 bit latch/transceiver designs.Products decrease component footprint, weight and power for other systems. High temperature process tolerance will also be examined.

* Information listed above is at the time of submission. *

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