NDI for Diffusion Bonded Components

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$0.00
Award Year:
2001
Program:
SBIR
Phase:
Phase I
Contract:
F33615-01-C-5207
Agency Tracking Number:
001ML-3516
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
NONVOLATILE ELECTRONICS, INC.
11409 Valley View Road, Eden Prairie, MN, 55344
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
114264351
Principal Investigator:
Carl Smith
Senior Physicist
(952) 829-9217
chsmith@nve.com
Business Contact:
Richard George
Chief Financial Officer
(952) 996-1602
dickg@nve.com
Research Institution:
n/a
Abstract
It is proposed to use spin dependent tunneling (SDT) and giant magnetoresistance (GMR) magnetic sensors and eddy current techniques for Non-Destructive Inspection (NDI) to detect flaws in various metallic components including cracks around rivet holes andfailed bonds in diffusion bonded components. This Phase II proposal is directed towards designing, optimizing, manufacturing, and demonstrating several GMR and SDT eddy current probes and probe arrays specifically designed to detect varying crack depths,crack sizes, and surface configurations. The design of the sensors used in these probes will be further optimized to maximize resolution and sensing depth based on the results of the Phase I project. The sensors also include hybrids sensors using ASICchips for on-board signal processing or multiplexing. The optimization of on-board excitation coils started in Phase I will also be pursued. We will continue our contacts with aerospace and other interested companies during this Phase II project.Commercialization of the technology is proceeding through the formation of a class S company, Albany Instruments, Inc., a subcontractor on this proposal. At the end of the project we will have prototype sensors and sensor arrays designed to meet specificNDI applications. These prototypes will be ready for Phase III commercialization.

* information listed above is at the time of submission.

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