You are here

Entangled Photon Pair SourceBased On Thin-Film Lithium-Niobate-On-InsulatorPhotonic Integrated Circuits

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC23CA013
Agency Tracking Number: 212489
Amount: $749,991.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: T5
Solicitation Number: STTR_21_P2
Solicitation Year: 2021
Award Year: 2023
Award Start Date (Proposal Award Date): 2022-12-20
Award End Date (Contract End Date): 2024-12-19
Small Business Information
116 Sandy Drive
Newark, DE 19713-1187
United States
DUNS: 805473951
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Peng Yao
 (302) 286-5191
Business Contact
 Ahmed Sharkawy
Phone: (302) 898-5544
Research Institution
 Rochester Institute of Technology
1 Lomb Memorial Drive
Rochester, NY 14623-0000
United States

 Federally Funded R&D Center (FFRDC)

Herein, PSI propose a system-on-chip (SoC) solution for an entangled photon pair source (EPPS) based on thin-film lithium niobate on insulator (TFLNOI) photonic integrated circuits (PIC). Using integrated photonic devices such as fiber coupler, waveguide, modulator, splitter/combiner and micro-ring, the proposed EPPS can generate and process the entangled photons with high efficiency and speed. In phase I effort, we developed theoretical models to study the spontaneous parametric down conversion (SPDC) conversion efficiencies based on both hybrid and ridge waveguide LNOI PIC designs. We have successfully demonstrated an in-situ monitored periodically poling process with small poling periods and large poling gaps. Leveraging other on-going PSI projects, we have also fabricated and characterized the key PIC components for the proposed EPPS chip, including low-loss waveguides, fiber coupler, high extinction splitter/combiner, micro-ring resonator and high-speed modulator. The phase I result paved a solid foundation toward a high-efficiency EPPS PIC chip. In phase II, we will continue the PIC components development focusing on the ridge waveguide designs, and experimentally demonstrate all the key PIC components. We will further refine the periodically poled LNOI (PPLNOI) process with improved accuracy and automation. Through the collaboration with RIT, our subcontractor, who has significant experiences in quantum photonic system testing and characterization, we will demonstrate the entanglement of the SPDC generated photon pair. Lastly, we will perform initial integration and packaging for the EPPS chip based on advanced photonic wire-bonding technology. Based on our pioneer work in TFLNOI PICs development and with our successful experiences in commercialization of SBIR research efforts, PSI is poised to develop, package, qualify and commercialize the proposed EPPS chip for tomorrowrsquo;s quantum communication demands.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government