Polymer-based Packaging-Compatible Board-Level Optical Bus

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$0.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
N0001402C0279
Award Id:
63965
Agency Tracking Number:
02-0613
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
13010 Research Blvd., Suite 21, Austin, TX, 78750
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
102861262
Principal Investigator:
Bipin Bihari
Senior Research Scientist
(512) 996-8833
bipin.bihari@eomegaoptics.com
Business Contact:
Kenneth Chen
President
(512) 633-6934
kenneth.chen@eomegaoptics.com
Research Institute:
n/a
Abstract
In this proposed Phase II program we will develop board-level optical waveguides to alleviate the ever-tightening electrical interconnection bottleneck. VLSI provides fast intrinsic signal speeds but these speeds cannot be supported by electricalinterconnects between other chips on the same board. Conversion to optical interconnects at the intra-board level can overcome these limits. The practical limits of optical interconnects arises from the optoelectronic transmitters and receivers, whichcurrently have bandwidths up to 10GHZ. The emerging 40-GHz OC-768 telecommunications standard is a strong indication that optical interconnects will keep pace with VLSI for many years. However, their cost-effective assimilation into conventionaltechnologies remains the major unresolved issue. Therefore, we propose an optoelectronic board-level bus employing a fully imbedded optical interconnection layer based on polymeric waveguides, thin-film vertical-cavity-surface-emitting lasers (VCSELs) andthin-film metal-semiconductor-metal (MSM) photodetectors, integrated onto a PCB structure and planarized to allow conventional integration of noncritical electrical interconnects. Optical couplers will couple light between the transceivers and the chipsmounted on the boards's surface. By demonstrating these integrations we will prove the practicality of high speed board-level optical interconnects, which should lead to Phase III commercialization.

* information listed above is at the time of submission.

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