Polymer-based Packaging-Compatible Board-Level Optical Bus

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N0001402C0279
Agency Tracking Number: 02-0613
Amount: $749,870.00
Phase: Phase II
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
13010 Research Blvd., Suite 21, Austin, TX, 78750
DUNS: 102861262
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Bipin Bihari
 Senior Research Scientist
 (512) 996-8833
Business Contact
 Kenneth Chen
Title: President
Phone: (512) 633-6934
Email: kenneth.chen@eomegaoptics.com
Research Institution
In this proposed Phase II program we will develop board-level optical waveguides to alleviate the ever-tightening electrical interconnection bottleneck. VLSI provides fast intrinsic signal speeds but these speeds cannot be supported by electricalinterconnects between other chips on the same board. Conversion to optical interconnects at the intra-board level can overcome these limits. The practical limits of optical interconnects arises from the optoelectronic transmitters and receivers, whichcurrently have bandwidths up to 10GHZ. The emerging 40-GHz OC-768 telecommunications standard is a strong indication that optical interconnects will keep pace with VLSI for many years. However, their cost-effective assimilation into conventionaltechnologies remains the major unresolved issue. Therefore, we propose an optoelectronic board-level bus employing a fully imbedded optical interconnection layer based on polymeric waveguides, thin-film vertical-cavity-surface-emitting lasers (VCSELs) andthin-film metal-semiconductor-metal (MSM) photodetectors, integrated onto a PCB structure and planarized to allow conventional integration of noncritical electrical interconnects. Optical couplers will couple light between the transceivers and the chipsmounted on the boards's surface. By demonstrating these integrations we will prove the practicality of high speed board-level optical interconnects, which should lead to Phase III commercialization.

* Information listed above is at the time of submission. *

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