STTR Phase I: Fully Embedded Optical Interconnect Layers Based on Molded Polymer Lightwave Components for Large Field Size Printed Circuit Boards

Award Information
National Science Foundation
Award Year:
Phase I
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
Solicitation Number:
Small Business Information
Omega Optics
10435 Burnet Road, Austin, TX, 78758
Hubzone Owned:
Minority Owned:
Woman Owned:
Principal Investigator:
Wei Jiang
(512) 996-8833
Business Contact:
Diane Chen
(512) 996-8833
Research Institution:
Univ of TX Austin
Ray T Chen
J J Pickle Research Campus
Austin, TX, 78758
(512) 471-7035
Nonprofit college or university
This Small Business Technology Transfer (STTR) Phase I project aims at developing a commercially viable optical interconnect technology. Conventional optical interconnect technologies suffer from planar optical waveguides with small dimensions in the vertical direction, which leads to alignment difficulties, laser coupling efficiency reduction, and deteriorated packaging reliability. These optical interconnect technologies also fail to provide transmission over a large field size, and the insertion of optical interconnects is incompatible with electronic device packaging. In this program, it is proposed to develop a fully embedded optical interconnection layer within the three dimensional (3D) electrical interconnect layers using molded optical waveguides in conjunction with thin film lasers and thin film photodetectors (both ~ 10 micron in thickness). The selection of polymer based molded waveguides solves two pending problems, the small field size of the interconnects and the shallow depth of the waveguides. The proposers intend to demonstrate up to 24"x36" molded waveguide films having waveguide dimensions of 50 microns by 50 microns, which make the alignment, and therefore packaging, of laser diodes and photodetectors highly reliable. Such a waveguide depth is not economically feasible using any other waveguide technologies. Commercially, using current communication devices, future data transmission demands at the printed circuit board and system level will be difficult to achieve with current copper interconnect technology due to issues regarding signal attenuation, electromagnetic interference, and parasitic noise. The state of the art electrical interconnect technology is anticipated to hit a deadlock between 2008 and 2012 at speeds above 10Gb/s. The proposed research provides a unique solution that reliably incorporates the optical interconnects into printed circuit board (PCB) fabrication and integration. The result of this research program will lay a solid foundation for a future PCB industry, which is critical for the United States to lead the market for the years to come.

* information listed above is at the time of submission.

Agency Micro-sites

SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government