UHF to L-Band Linear Amplifier 3-D Dielectric Material Enhancements

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-08-C-0117
Agency Tracking Number: N062-120-0040
Amount: $1,248,760.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: 2006
Solicitation Topic Code: N06-120
Solicitation Number: 2006.2
Small Business Information
Purdue Technology Center, 3000 Kent Avenue Suite D1-106, West Lafayette, IN, 47906
DUNS: 141450135
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jacob Smelser
 (765) 775-1011
Business Contact
 Jacob Smelser
Title: President
Phone: (765) 775-1011
Email: jsmelser@omegaws.com
Research Institution
In both the commercial and military electronics markets, there is a continuing trend to reduce size, weight, and overall equipment costs, while at the same time increasing functionality and improving reliability of the electronic circuitry. Integrated circuit manufacturers have addressed this need by integrating greater functionality directly onto the silicon chips, thus yielding the System-on-Chip approach. This technique, however, only addresses a portion of the problem. While it does provide for a reduction in size and cost while increasing overall functionality, these ICs still need to be packaged into functional end applications. The ICs typically still require a large number of discrete circuitry to support their functionality. The integration of these ICs and required discrete circuitry into a single end application package is the System-in-Package (SiP) approach. Newer packaging techniques, improved material sets, and new methods of passively integrating circuitry are being developed which allow for a further reduction in size and cost in the final package. Omega Wireless Solutions is adept at advanced packaging, passive integration, and electromagnetic simulation, and has the tools and abilities necessary to integrate the U.S. Navy's Quadrature LINC architecture into a small form factor utilizing the latest SiP techniques.

* Information listed above is at the time of submission. *

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