UHF to L-Band Linear Amplifier 3-D Dielectric Material Enhancements

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$749,330.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
N68335-08-C-0117
Award Id:
77371
Agency Tracking Number:
N062-120-0040
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Purdue Technology Center, 3000 Kent Avenue Suite D1-106, West Lafayette, IN, 47906
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
141450135
Principal Investigator:
Jacob Smelser
President
(765) 775-1011
jsmelser@omegaws.com
Business Contact:
Jacob Smelser
President
(765) 775-1011
jsmelser@omegaws.com
Research Institution:
n/a
Abstract
In both the commercial and military electronics markets, there is a continuing trend to reduce size, weight, and overall equipment costs, while at the same time increasing functionality and improving reliability of the electronic circuitry. Integrated circuit manufacturers have addressed this need by integrating greater functionality directly onto the silicon chips, thus yielding the System-on-Chip approach. This technique, however, only addresses a portion of the problem. While it does provide for a reduction in size and cost while increasing overall functionality, these ICs still need to be packaged into functional end applications. The ICs typically still require a large number of discrete circuitry to support their functionality. The integration of these ICs and required discrete circuitry into a single end application package is the System-in-Package (SiP) approach. Newer packaging techniques, improved material sets, and new methods of passively integrating circuitry are being developed which allow for a further reduction in size and cost in the final package. Omega Wireless Solutions is adept at advanced packaging, passive integration, and electromagnetic simulation, and has the tools and abilities necessary to integrate the U.S. Navy's Quadrature LINC architecture into a small form factor utilizing the latest SiP techniques.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government