Optoelectronic Packaging Technology for High Speed Switching

Award Information
Agency:
Department of Defense
Amount:
$64,817.00
Program:
SBIR
Contract:
N/A
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Missile Defense Agency
Award Year:
1996
Phase:
Phase I
Agency Tracking Number:
32035
Solicitation Topic Code:
N/A
Small Business Information
Opticomp Corp
P.o. Box 10779, 215 Elks, Point Rd., Zephyr Cove, NV, 89448
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
N/A
Principal Investigator
 Peter S. Guilfoyle
 (702) 588-4176
Business Contact
Phone: () -
Research Institution
N/A
Abstract
The principal objective of this proposal is to develop a design for the packaging of the high performance optoelectronic computer (HPOC) module. In addition, we will design the optical interconnect section of the HPOC module, and fabricate and test HPOC module sub-assemblies. A design will be developed for a structure which uses solder engineering to combine the HPOC module components (VCSEL, array, optical interconnect sub-assembly, and receiver array) into one solid, stable package. The ability of solder engineering techniques to passively align electronic and optical components to tolerances of "approx" 1 mm will be exploited to simplify the alignment task. A modified version of the Gerchberg-Saxton algorithm will be used to design a compound diffractive optical element which combines the functions of most, or all, of the discrete optical components which currently compose the optical interconnect section of the HPOC module. Reducing the number of components will greatly reduce the complexity of the assembly and packaging task, and should also significantly reduce the cost of the final device. Selected HPOC module component will be fabricated and will be combined into sub-assemblies which will be tested to verify the performance of our designs.

* information listed above is at the time of submission.

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