Optoelectronic Chip-to-Chip Interconnect Technology Development for Radiation Hard Space Applications
Department of Defense
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Small Business Information
PO Box 10779, Zephyr Cove, NV, 89448
Socially and Economically Disadvantaged:
AbstractThe primary goal of the proposed Phase II SBIR effort is to develop and fabricate high-speed interconnects utilizing GaAs-based monolithic switching modules and hybrid waveguides in order to relieve the chip-to-chip interconnect bottleneck. The switchingmodules include VCSELs and resonant cavity photodetectors with on-chip multiplexing/demultiplexing. These high-speed interconnects are realized using a unique distributed switching architecture that is low-cost, fault-tolerant, redundant,format-independent, and dynamically reconfigurable. This architecture and the associated hardware can be readily implemented to realize high-speed, dynamic chip-to-chip interconnects for demanding computing and signal processing applications. OptiCompCorporation (OCC) occupies a 7000 square foot facility that includes a full-service, backend semiconductor fabrication cleanroom and optoelectronic device integration laboratory, an optoelectronic device testing laboratory, and MBE-based semiconductorcrystal growth capabilities. OCC's design center includes device modeling software for VCSELs and waveguide structures, as well as full EDA schematic capture, mask, and PCB layout. These facilities support device modeling and design, growth, fabrication,integration, and testing.
* information listed above is at the time of submission.