Optoelectronic Chip-to-Chip Interconnect Technology Development for Radiation Hard Space Applications

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$749,955.00
Award Year:
2003
Program:
SBIR
Phase:
Phase II
Contract:
F29601-03-C-0030
Agency Tracking Number:
021NM-0276
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
OPTICOMP CORP.
PO Box 10779, Zephyr Cove, NV, 89448
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
161162896
Principal Investigator
 Peter Guilfoyle
 President/CEO
 (775) 588-4176
 peterg@opticomp.com
Business Contact
 Rodney Lampson
Title: Treasurer
Phone: (775) 588-4176
Email: rodneyl@opticomp.com
Research Institution
N/A
Abstract
The primary goal of the proposed Phase II SBIR effort is to develop and fabricate high-speed interconnects utilizing GaAs-based monolithic switching modules and hybrid waveguides in order to relieve the chip-to-chip interconnect bottleneck. The switchingmodules include VCSELs and resonant cavity photodetectors with on-chip multiplexing/demultiplexing. These high-speed interconnects are realized using a unique distributed switching architecture that is low-cost, fault-tolerant, redundant,format-independent, and dynamically reconfigurable. This architecture and the associated hardware can be readily implemented to realize high-speed, dynamic chip-to-chip interconnects for demanding computing and signal processing applications. OptiCompCorporation (OCC) occupies a 7000 square foot facility that includes a full-service, backend semiconductor fabrication cleanroom and optoelectronic device integration laboratory, an optoelectronic device testing laboratory, and MBE-based semiconductorcrystal growth capabilities. OCC's design center includes device modeling software for VCSELs and waveguide structures, as well as full EDA schematic capture, mask, and PCB layout. These facilities support device modeling and design, growth, fabrication,integration, and testing.

* information listed above is at the time of submission.

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