High Channel Density Interconnect Modules for Air Platforms

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,982.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
F33615-03-M-3339
Agency Tracking Number:
F031-1189
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
OPTICOMP CORP.
PO Box 10779, Zephyr Cove, NV, 89448
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
161162896
Principal Investigator:
Peter Guilfoyle
President/CEO
(775) 588-4176
peterg@opticomp.com
Business Contact:
Charles Masters
V.P. of Government Affair
(775) 588-4176
cmasters@opticomp.com
Research Institution:
n/a
Abstract
The primary goal of the proposed Phase I SBIR effort is to develop high channel-density interconnect modules for use in air platforms. This will be accomplished using a unique, monolithic, WDM, optoelectronic module that has a high interconnect density,small form-factor, and is rugged enough to withstand harsh operating environments. OptiComp Corporation occupies a 7,000 square foot facility, which includes a full service, backend semiconductor fabrication cleanroom and optoelectronic device integrationlaboratory, a optoelectronic testing area, and a MBE-based growth facility. OCC's design center includes optoelectronic device modeling and design, growth, fabrication, integration, and testing capabilities. The proposed program will offer a dual use commercialization opportunity for providing dense interconnects in a harsh operating environment, such as in commercial and military aircraft. The ruggedized, small form-factor modules will reduce fiber-countand electromagnetic interference through the use of coarse WDM. This interconnect scheme has significant market potential as the demand for data-capacity increases.

* information listed above is at the time of submission.

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