High Channel Density Interconnect Modules for Air Platforms

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F33615-03-M-3339
Agency Tracking Number: F031-1189
Amount: $99,982.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
OPTICOMP CORP.
PO Box 10779, Zephyr Cove, NV, 89448
DUNS: 161162896
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Peter Guilfoyle
 President/CEO
 (775) 588-4176
 peterg@opticomp.com
Business Contact
 Charles Masters
Title: V.P. of Government Affair
Phone: (775) 588-4176
Email: cmasters@opticomp.com
Research Institution
N/A
Abstract
The primary goal of the proposed Phase I SBIR effort is to develop high channel-density interconnect modules for use in air platforms. This will be accomplished using a unique, monolithic, WDM, optoelectronic module that has a high interconnect density,small form-factor, and is rugged enough to withstand harsh operating environments. OptiComp Corporation occupies a 7,000 square foot facility, which includes a full service, backend semiconductor fabrication cleanroom and optoelectronic device integrationlaboratory, a optoelectronic testing area, and a MBE-based growth facility. OCC's design center includes optoelectronic device modeling and design, growth, fabrication, integration, and testing capabilities. The proposed program will offer a dual use commercialization opportunity for providing dense interconnects in a harsh operating environment, such as in commercial and military aircraft. The ruggedized, small form-factor modules will reduce fiber-countand electromagnetic interference through the use of coarse WDM. This interconnect scheme has significant market potential as the demand for data-capacity increases.

* information listed above is at the time of submission.

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