Chip-to-Chip Optical Interconnects Using Photonic Crystal Emitters and Waveguides

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$99,995.00
Award Year:
2004
Program:
STTR
Phase:
Phase I
Contract:
FA9550-04-C-0016
Agency Tracking Number:
F033-0322
Solicitation Year:
2003
Solicitation Topic Code:
AF03T021
Solicitation Number:
N/A
Small Business Information
OPTICOMP CORP.
PO Box 10779, Zephyr Cove, NV, 89448
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
161162896
Principal Investigator
 Duane Louderback
 Member of the Technical Staff
 (775) 588-4176
 duanel@opticomp.com
Business Contact
 Peter Guilfoyle
Title: CEO
Phone: (775) 588-4176
Email: peterg@opticomp.com
Research Institution
 UNIV. OF ILLINOIS
 Charles F Zukoski
 109 Coble Hall M/C 325, 801 S. Wright Street
Champaign, IL, 61820
 (217) 333-2187
 Nonprofit college or university
Abstract
The goal of this proposed Phase I STTR effort is to demonstrate the feasibility of incorporating photonic crystal (PC) technology within OCC's existing optoelectronic module technology. This will be accomplished through the design and modeling of PC light emitters and waveguides, as well as characterization of their coupling behavior with external systems. The utilization of nanoscale PC technology promises superior wavelength selectivity, reduced temperature sensitivity, and increased density of interconnecting waveguides. OptiComp Corporation occupies a 7000 square foot facility, which includes a full service, semiconductor fabrication cleanroom with MBE wafer growth as well as optoelectronic testing and measurement laboratories. OptiComp design facility includes semiconductor modeling and CAD capabilities. In addition, the University of Illinois' Micro and Nanotechnology Laboratories include an 8000 square foot class 100 fabrication and 8000 square foot class 1000 growth facility. The proposed Phase I STTR effort will offer a dual use commercialization opportunity for applications such as photonic crystal (PC) optoelectronic chip-to-chip interconnects. Such devices can provide terabit bandwidths for on-board, radiation-hard, space applications, as well as specialized military platforms and commercial datacom systems.

* information listed above is at the time of submission.

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