PACKAGING OPTOELECTRONIC MODULES

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$375,354.00
Award Year:
1993
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Agency Tracking Number:
18355
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Optivision, Inc.
4009 Miranda Avenue, Palo Alto, CA, 94304
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Robert Kalman
(415) 855-0200
Business Contact:
() -
Research Institution:
n/a
Abstract
PACKAGING POSES A MAJOR IMPEDIMENT TO THE PRACTICAL IMPLEMENTATION OF OPTO-ELECTRONIC MODULES (OEMS). OEMS MAY REQUIRE MULTIPLE FIBER-OPTIC INTERFACES AND LARGE ELECTRICAL PIN-OUT, AND MAY DISSIPATE SIGNIFICANT POWER. WE PROPOSE A PROGRAM TO DEVELOP NEW PACKAGING TECHNIQUES TO ADDRESS THE NEEDS OF OEMS. IN THIS PROJECT, WE WILL UTILIZE OPTIVISION'S PREVIOUS EXPERIENCE IN THE PACKAGING AND APPLICATION OF OPTO-ELECTRONIC DEVICES. A MAJOR THRUST OF THIS PROGRAM IS THE INVESTIGATION AND DEVELOPMENT OF SEVERAL NOVEL MULTI-FIBER OPTICAL INTERFACING TECHNIQUES BASED ON THE USE OF PLANAR OPTICAL WAVEGUIDES MADE FROM SIO2 ON A SILICON SUBSTRATED. SIO2/SI WAVEGUIDE TECHNOLOGY MAY PROVIDE HIGH-PERFORMANCE, LOW-COST, COMPACT, RUGGED OPTICAL INTERFACES WHICH CAN BE APPLIED TO A BROAD CLASS OF OEMS. THE APPLICATION OF CURRENT ADVANCED ELECTRONIC AND OPTO-ELECTRONIC PACKAGING TO OEMS WILL BE EXPLORED, INCLUDING THE USE OF ADVANCED METALS AND CERAMICS, THERMOELECTRIC COOLING, AND FLIP-CHIP DEVICE MOUNTING. PACKAGE PERFORMANCE OVER A RANGE OF ENVIRONMENTAL CONDITIONS (TEMPERATURE, VIBRATION) WILL BE INVESTIGATED. A CANDIDATE OEM WILL BE SELECTED FOR PACKAGING DURING THE PHASE II EFFORT, AND A DETAILED PACKAGE DESIGN WILL BE DEVELOPED FOR THIS DEVICE. ANTICIPATED BENEFITS: THIS RESEARCH PROJECT ADDRESSES KEY DESIGN AND FEASIBILTY ISSUES IN THE PACKAGING OF OPTO-ELECTRONIC MODULES (OEMS). IT WILL PROVIDE ADVANCED IN PACKAGING TECHNOLOGY NECESSARY TO ALLOW THE USE OF OEMS IN WIDE VARIETY OF DOD AND COMMERCIAL APPLICATIONS INCLUDING FIBER-OPTIC NETWORKS, OPTICAL BACKPLANES, AND PHASED ARRAY ANTENNAS.

* information listed above is at the time of submission.

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