Superlens Integrated Packaging for Ruggedized Laser Diode Module in Wavelength Division Multiplexed Networks

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$100,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
N68335-04-C-0137
Agency Tracking Number:
N041-003-0760
Solicitation Year:
2004
Solicitation Topic Code:
N04-003
Solicitation Number:
2004.1
Small Business Information
OPTONET
120 Picardy Lane, Wheeling, IL, 60090
Hubzone Owned:
N
Socially and Economically Disadvantaged:
Y
Woman Owned:
N
Duns:
141545447
Principal Investigator:
Jing Ma
Director of Technology De
(847) 208-3918
jma1994@yahoo.com
Business Contact:
Seng-Tiong Ho
Chairman
(224) 588-0958
optonetinc@yahoo.com
Research Institution:
n/a
Abstract
Diode laser module for wavelength-division-multiplexed networks in rugged military avionic environment must be capable of large operating temperature range from -40C to 85 C and must have an ultra-low profile of <0.14". Typical commercial packaging for optoelectronic devices is not adequate. Here we describe a new packaging platform technology involving our recently-developed integrated miniature precision lens on silicon bench capable of addressing the present limitations. The miniature lens is referred to as "Superlens". In the proposed work, ruggedized laser diode module for military avionic applications will be realized based on our Superlens integrated packaging (SLIP) platform. The powerful SLIP platform has the advantages of: (1) Large Temperature Range; (2) Ultra Low Profile; (3) High Modulation Frequency; (4) In-Module Optical Isolator and Wavelength Locker; (5) High Fiber Coupling Efficiency; (6) High Manufacturability and Component Expandability; (7) Low Optical Packaging Costs via Passive-Alignment; (8) Low Electronics Packaging Costs; (9) Highly Integrated with monolithically integrated Superlens, sensors, heaters, RF lines, and electronic circuits, leading to ruggedized compact laser diode modules with high optical, electrical, thermal, and mechanical performances, as well as high manufacturability and lower costs.

* information listed above is at the time of submission.

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