Integrated Packaging for Ruggedized Laser Diode Module in Wavelength Division Multiplexed Networks

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$999,967.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
N68335-05-C-0301
Agency Tracking Number:
N041-003-0760
Solicitation Year:
2004
Solicitation Topic Code:
N04-003
Solicitation Number:
2004.1
Small Business Information
OPTONET
828 Davis Street, Suite 206, Evanston, IL, 60201
Hubzone Owned:
N
Socially and Economically Disadvantaged:
Y
Woman Owned:
N
Duns:
141545447
Principal Investigator
 Jing Ma
 Vice President
 (847) 425-7585
 jma@optonetinc.com
Business Contact
 Jing Ma
Title: Vice President
Phone: (847) 425-7585
Email: jma@optonetinc.com
Research Institution
N/A
Abstract
Development of compact ruggedized high-quality high-speed tunable laser-diode transmitter packaging is critical to WDM network in both military and commercial applications. The objective of this research project is to bring the basic low-profile & large operating temperature range packaging technology developed into a very compact tunable laser module that can withstand military avionic environment. In Phase I, feasibility study of integrated compact ruggedized laser diode transmitter packaging was demonstrated. We have performed detailed design of the fiber coupling optics, thermal management, module casing, RF transmission line, optical isolator, and wavelength locker. We have successfully achieved the low-profile packaging needed. The packaged modules we achieved have high coupling efficiency and low module height. Phase II will pursue advanced development of ruggedized tunable laser module. The laser will be tunable over 4 or more channels with 50GHz channel spacing. The module will have a built-in wavelength locker. The compact ruggedized laser module will be designed for low profile, high reliability, and extended temperature range. The tunable laser module will undergo environmental qualifications for operation under military avionic conditions. The entire module will be fabricated and integrated into a demonstration board, including wavelength control circuits.

* information listed above is at the time of submission.

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