High-Resolution, Laser-Heated High-Temperature Target Simulator

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-06-C-0115
Agency Tracking Number: 053-0828
Amount: $99,868.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: MDA05-042
Solicitation Number: 2005.3
Small Business Information
461 Boston Street, Topsfield, MA, 01983
DUNS: 038336723
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Mansur
 Optical Engineer
 (978) 887-6600
Business Contact
 James Engel
Title: President
Phone: (978) 887-6600
Email: jengel@optra.com
Research Institution
We describe a versatile 512 x 512 pixel high-temperature target simulator based on the use of radiation from laser diodes to heat small (~100 micron) graphite chip target elements. By using laser diodes in this manner we can avoid the need to make electrical contact with the target chips, thereby minimizing thermal conduction paths from each chip; by enclosing the target chips in a small vacuum enclosure (~5 cm in diameter) we eliminate convective heat losses and minimize the possibility of oxidization of the target chips. We further propose the use of optical fibers to link the laser diodes to the target chips; in this way we can separate the laser diode arrays from the high-temperature target array, greatly simplifying operation of the target simulator in a 20°K environment. Initial modeling suggests that at high temperatures the target elements can achieve thermal time constants on the order of 1 msec. Radiation by the target chips should very closely approximate blackbody radiation for wavelengths in the visible out to beyond 12 microns.

* Information listed above is at the time of submission. *

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