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In-Cylinder Pressure Sensors Using Thin Film Shape Memory Alloys

Award Information
Agency: Department of Defense
Branch: Army
Contract: A982-1870
Agency Tracking Number: A982-1870
Amount: $120,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1999
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
11000 Cedar Ave., Suite 170
Cleveland, OH 44106
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Frederick Lisy
 (216) 791-6749
Business Contact
Phone: () -
Research Institution
N/A
Abstract

Not Available The U.S. Navy uses fill fluids in their sonar towed arrays to provide high quality sonar performance, proper buoyancy, and corrosion protection for the sonar electronic components. The currently used fluid, Isopar L, poses two environmental hazards, the first to humans during the filling operation, and the second to the marine environment as a result of accidental leakage. In this Phase I program, Foster-Miller proposes to identify an inherently more environmentally friendly fill fluid using a computer model based on group contribution theory. The five most promising candidates will then be tested in the laboratory for key physical, chemical, and environmental properties. After identifying a new fill fluid, Foster-Miller will then develop one or more innovative additives for the fill fluid that will minimize the environmental impact of a leak or spill in the marine environment. These additives will create a fill fluid system that is self-remediating, making the fluid non-persistent. At the conclusion of the Phase I program with Option, a new fluid will have been identified and several concepts for self-remediation will have been surveyed for further development. In the Phase II program, the development and optimization of the self-remediating additives will be performed.

* Information listed above is at the time of submission. *

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