Ormet Circuits, Inc.

Basic Information

2236 Rutherford Road, Suite 109
Carlsbad, CA, 92008

Company Profile

n/a

Additional Details

Field Value
DUNS: 51656168
Hubzone Owned: N
Socially and Economically Disadvantaged: N
Woman Owned: N
Number of Employees: 6


  1. Lead-free Solder Alternative Interconnect Material

    Amount: $99,399.00

    The elimination of lead from most electronic assembly applications has had a number of repercussions. The low temperature alternatives suffer from detrimental performance and cost limitations. The hig ...

    SBIR Phase I 2010 Air Force Department of Defense
  2. Compact, Polymer-Based IC Package with Integrated Passives and Active Cooling

    Amount: $66,141.00

    "Development of a polymer-based semiconductor chip package integrated with embedded passives and active cooling is proposed. Integration will increase overall system performance, reduce the PWB real e ...

    STTR Phase I 2002 Missile Defense Agency Department of Defense
  3. N/A

    Amount: $0.00

    N/A

    SBIR Phase I 2000 Missile Defense Agency Department of Defense
  4. N/A

    Amount: $350,024.00

    N/A

    SBIR Phase II 2000 Missile Defense Agency Department of Defense
  5. Integration of Passive Components into Organic MCM Packages

    Amount: $99,003.00

    N/A

    SBIR Phase I 1999 Air Force Department of Defense
  6. Self-Cooled, Highly Integrated Area Array IC Chip Carrier

    Amount: $69,890.00

    N/A

    STTR Phase I 1999 Navy Department of Defense
  7. New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

    Amount: $763,000.00

    High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide ...

    SBIR Phase II 1998 Army Department of Defense
  8. Compact, High Performance Thermelectric Modules for Thermal Management of Electronic Packaging

    Amount: $64,892.00

    As electronic devices become smaller, faster and more complex, their need for high heat dissipation turns into a pressing concern. Cumbersome cooling systems such as large heat sinks, forced air cooli ...

    SBIR Phase I 1998 Missile Defense Agency Department of Defense
  9. New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

    Amount: $95,539.00

    High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide ...

    SBIR Phase I 1997 Army Department of Defense
  10. ENVIRONMENTALLY STABLE EMBEDDED COMPONENTS FOR SEVERE ENVIRONMENT MULTICHIP MODULES

    Amount: $1,554,538.00

    The objective of Phase I will be to fabricate resistors, capacitors, and inductors using these materials and do some preliminary environmental testing on them. Phase II objective would be to demonstra ...

    SBIR Phase II 1996 Missile Defense Agency Department of Defense

Agency Micro-sites

US Flag An Official Website of the United States Government