Ormet Circuits, Inc.

Address

2236 Rutherford Road, Suite 109
Carlsbad, CA, 92008

Information

DUNS: 51656168
# of Employees: 6

Ownership Information

Hubzone Owned: N
Socially and Economically Disadvantaged: N
Woman Owned: N

Award Charts




Award Listing

  1. Lead-free Solder Alternative Interconnect Material

    Amount: $99,399.00

    The elimination of lead from most electronic assembly applications has had a number of repercussions. The low temperature alternatives suffer from detrimental performance and cost limitations. The hig ...

    SBIRPhase I2010Air Force Department of Defense
  2. Compact, Polymer-Based IC Package with Integrated Passives and Active Cooling

    Amount: $66,141.00

    "Development of a polymer-based semiconductor chip package integrated with embedded passives and active cooling is proposed. Integration will increase overall system performance, reduce the PWB real e ...

    STTRPhase I2002Missile Defense Agency Department of Defense
  3. N/A

    Amount: $0.00

    N/A

    SBIRPhase I2000Missile Defense Agency Department of Defense
  4. N/A

    Amount: $350,024.00

    N/A

    SBIRPhase II2000Missile Defense Agency Department of Defense
  5. Integration of Passive Components into Organic MCM Packages

    Amount: $99,003.00

    N/A

    SBIRPhase I1999Air Force Department of Defense
  6. Self-Cooled, Highly Integrated Area Array IC Chip Carrier

    Amount: $69,890.00

    N/A

    STTRPhase I1999Navy Department of Defense
  7. New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

    Amount: $763,000.00

    High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide ...

    SBIRPhase II1998Army Department of Defense
  8. Compact, High Performance Thermelectric Modules for Thermal Management of Electronic Packaging

    Amount: $64,892.00

    As electronic devices become smaller, faster and more complex, their need for high heat dissipation turns into a pressing concern. Cumbersome cooling systems such as large heat sinks, forced air cooli ...

    SBIRPhase I1998Missile Defense Agency Department of Defense
  9. New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

    Amount: $95,539.00

    High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide ...

    SBIRPhase I1997Army Department of Defense
  10. ENVIRONMENTALLY STABLE EMBEDDED COMPONENTS FOR SEVERE ENVIRONMENT MULTICHIP MODULES

    Amount: $1,554,538.00

    The objective of Phase I will be to fabricate resistors, capacitors, and inductors using these materials and do some preliminary environmental testing on them. Phase II objective would be to demonstra ...

    SBIRPhase II1996Missile Defense Agency Department of Defense

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