High Strength Soldering Compounds Produced from Gas Atomized Powered Metal Alloys

Award Information
Agency:
Department of Defense
Amount:
$500,000.00
Program:
SBIR
Contract:
N/A
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Missile Defense Agency
Award Year:
1993
Phase:
Phase II
Agency Tracking Number:
18038
Solicitation Topic Code:
N/A
Small Business Information
Toranaga Technologies, Inc.
2236 Rutherford Road, Suite, 123, Carlsbad, CA, 92008
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
N/A
Principal Investigator
 Kevin Christiam
 (619) 931-7096
Business Contact
Phone: () -
Research Institution
N/A
Abstract
Sn-Pb solder alloys used now to solder electronics fail from fatigue cracking. Attempts involving new binary and ternary alloys have increased strengths less than 10% over current solders. No substitute exists with higher mechanical strength yet melting below 210 degrees Celsius, compatible with electronics. Company proposes using novel gas atomized powders to join electronic componentry. Powders will be fabricated which effectively "melt" and fuse well below their known melt temperature. Through low temperature fusion of high temperature alloy powders, gains in solder joint strength exceeding 400% are anticipated. The objective is creation of a new solder substitute which exhibits superior strength though processed below 210 degrees Celsius to replace solder in electronic joints. The proposal also anticipates a lead free solder replacement and eliminating solders of different melting temperatures in step soldering.

* information listed above is at the time of submission.

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