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ENVIRONMENTALLY STABLE EMBEDDED COMPONENTS FOR SEVERE ENVIRONMENT MULTICHIP MODULES
Phone: (619) 931-7090
The objective of Phase I will be to fabricate resistors, capacitors, and inductors using these materials and do some preliminary environmental testing on them. Phase II objective would be to demonstrate repeatable, high quality formation of the buried components that will be based on current multichip module technology and will be fabricated using existing infrastructure of the printed circuit board industry.
* Information listed above is at the time of submission. *